NEW STUDY

Stuck on Precision: UV-Curable Adhesive Holds Thermocouples (TCs) Tight for Accurate Reflow Profiling

Discover how a UV-curable adhesive outperformed tape and solder in RIT testing—delivering reliable, repeatable thermocouple placement for precise PCB reflow profiling.

Accurate reflow profiling is essential for producing high-quality printed circuit board (PCB) assemblies. However, the thermocouple attachment method you choose can make or break the accuracy of your temperature data.

Conducted with testing through the Rochester Institute of Technology, we compare common thermocouple attachment techniques—high-temperature solder, polyimide tape, aluminum tape, and UV-curable adhesives—to determine which provides the most accurate and repeatable temperature readings during reflow soldering.

The results revealed that Dymax 9037-F, a UV-curable adhesive designed for electronics assembly, delivered the best performance across all test conditions. It maintained secure bonds through over 20 lead-free reflow cycles, preventing lifting, detachment, and measurement drift.

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