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Light-Curable Encapsulants for Protection of Printed Circuit Board Components
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2020Jun 23
https://bit.ly/3HzpMnr Dymax 9000-series encapsulants cure tack free in seconds upon exposure to UV/Visible light for superior protection of components on both flexible and rigid printed circuit board platforms. They are ideal for chip on board, flex, and glass, glob tops, bare die, integrated circuits, and wire tacking and bonding. Learn more at https://bit.ly/3HzpMnr. #electronicsmanufacturing #encapsulation #pcbassembly

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Dymax

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